Microfluidics Manufacturing: Anodic Bonding
The Bonder enables Anodic Bonding (Sealing) between a Silicon wafer and a Crystal Wafer. This seal is used primarily for connecting silicon / glass and metal / glass through electric fields.
The requirements for anodic bonding are cleaned surfaces availability on both wafers and the atomic contact between the binding substrates through an electrostatic field should be strong enough
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